1. with control software with independent intellectual property
rights, user-friendly interface, complete functions, simple
operation;
2. can process any graphics, cutting different thicknesses and
different materials can be processed and the synchronization is
complete hierarchical; optical system design optimization to ensure
high beam quality, reduce the focused spot size, to ensure
precision;
3. using high-performance UV laser with wave length, high beam
quality, higher peak power characteristics. Due to ultraviolet
light through decomposition, vaporization rather than melting
materials processing to achieve, so almost no post-processing
glitches, small thermal effect, no points
Layer, the effect of cutting precision, smooth, steep sidewalls.
4. using vacuum fixed sample, no mold protection plate is fixed,
convenient, improve processing efficiency.
5. can cut a variety of substrate materials, such as: silicon,
ceramic, glass and the like.
6. automatic correction, automatic positioning function,
multi-plate cutting, automatic thickness measurement and
compensation, motor Bank and compensation, working better
uniformity and small machining depth fluctuations, higher
processing efficiency of complex graphics.
FPC UV laser cutting machine, FPC laser cutting machine Technical
parameters:
Solid-state UV laser source laser wavelength: 355nm
PCB Laser Cutting Machine Specification| Item | PCB Laser Cutting Machine ZMLS5000DP |
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| Machine size(L*W*H) | 1680*1650*1800mm |
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| Weight | 2000KG |
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| Power supply | Single Phase AC220V/3KW |
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| Laser source | PS Laser/NS Laser |
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| Laser power | 15W/20W (Optional) |
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| Material thickness | ≦1.6mm (According to material) |
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| Whole machine precision | ±20 μm |
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| positioning precision | ±2 μm |
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| Repeat precision | ±2 μm |
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| Processing size | 350mm*450mm*2 |
|---|
| Focus spot diameter | 20 ± 5 μm |
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| Environment temperature/humidity | 20±2 °C/<60% |
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| Machine tool body | Marble |
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| Galvanometer system | Original imported |
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| Motion controlling system | Original imported |
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| Formats | Gerber,DXF, ASCII, Excellon I and II, sieb&Meier |
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| Necessary hardware and software | Including PC and CAM software |
|---|
| Working mode | Manual loading and unloading |
|---|
High performance laser: the use of international first-line brand
solid-state ultraviolet laser/green laser, with good beam quality,
focusing spot small, power distribution uniform, small thermal
effect, slit width small, cutting quality high advantages is the
guarantee of perfect cutting quality.
Fast and high precision: the combination of high precision, low
drift vibroscope and fast coreless linear motor system enables fast
cutting while maintaining high precision on the micron scale.
Fully automatic positioning: the use of high-precision CCD
automatic positioning, focusing, so that the positioning fast,
accurate and high precision, without manual intervention, simple
operation, to achieve the same type of one-button mode, greatly
improve the production efficiency.
Waste gas treatment system: suction system can eliminate all
cutting waste gas, avoid the harm to the operator and environmental
pollution.
High degree of automation: vibration mirror automatic correction,
automatic focus, the whole process of automation, the use of laser
displacement sensor to automatically adjust the height of the focus
to the table, to achieve rapid alignment, save time and worry.
Simple and easy to learn software: independently developed control
software based on Windows system, easy to operate Chinese
interface, friendly and beautiful, powerful and diverse functions,
simple and convenient operation.
